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product structure silicon monolithic integrated circuit ? this product is not designed prot ection against radioactive rays 1/17 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 k 14k 001 tsz02201-0g3g0c200280-1-2 21.dec.2012 rev.001 datashee t 320ma led camera flash driver with i 2 c compatible interface? bd6164gut ? general description the bd6164gut is 320ma flash led driver with synchronous rectification st ep up dc/dc converter that can drive 1 flash led. it is possible to choice flash and torch current by i 2 c i/f. ? features ? current regulation for led ? flash led current driver (260ma,280ma,300ma,320ma) ? assist light function led current driver (52ma, 72ma) ? high efficiency : 85% ( led current 300ma, vbat=3.6v, led vf=3.6v, 4mhz mode,ta=25 o c) ? i 2 c control i/f ? synchronous rectification step-up dc/dc converter ? high switching frequency 4mhz ? over voltage protection (ovp) ? in-rush current prevention (soft start) ? over current protection (ocp) ? under voltage lockout (uvlo) ? over temperature protection (otp) ? short-circuit fault detection (scf) ? internal generated power supply ? typical application circuit and block diagram ? key specifications ? operating power supply voltage range: 2.7v to 4.5v ? quiescent current: 1 a (typ.) ? switching frequency: 4.0mhz(typ.) ? operating temperature range: -30 ? to +85 ? ? package w(typ.) d(typ.) h (max.) ? applications torch light and flash for camera of mobile phone ?p n configuration v csp60n1 1.10mm x 1.50mm x 0.675mm cscl sda b ledout vout asw gnd 12 bottom view sw vout sda gnd 1.0h 2 x 1.5f battery 2.2f ledout flash led bd6164gut scl
datasheet datasheet 2/17 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 k 15k 001 tsz02201-0g3g0c200280-1-2 21.dec.2012 rev.001 bd6164gut ? absolute maximum ratings (ta=25 o c) parameter symbol rating unit maximum terminal voltage1 *1 vmax1 7 v maximum terminal voltage2 *2 vmax2 4.5 v power dissipation pd 550 *3 mw operating temperature r ange topr -30 to +85 o c storage temperature range tstg -55 to +150 o c *1 for sw, vout, ledout *2 for scl, sda *3 this value will be acquired from a sample device, mounted on a pcb by rohm. the temperature i ndicates the dissipation: 6.0 m w/ o c (from ta>25 o c) ? recommended operating ratings (ta=-30 o c to 85 o c) parameter symbol rating unit supply voltage vin 2.7 to 4.5 v ? electrical characteristics (unless otherwise noted, ta = -30 o c to+85 o c, vin=2.7v to 4.5v) parameter symbol min. typ. max. units conditions i 2 c control terminals sda/scl low bus voltage1 vthl1 - - 0.1 v high bus voltage1 vthh1 1.71 - - v high level input current iinh1 - - 2 a scl,sda=1.8v low level input current iinl1 -2 - - a scl,sda=0.0v led driver quiescent current (shutdown) iq, shdwn - 1 5 a shut down (sda/scl = 0v) quiescent current (stand by) iq, standby - 3 9 a stand by mode (sda/scl pull-up) led current accuracy iflash -7 0 7 % *2 led current accuracy inl inl -1 0 1 lsb led current accuracy dnl dnl -1 0 1 lsb current source saturation voltage vsat - 0.2 0.35 v @flash mode, led current=300ma,vout=4.0v inductor current limit icoil 0.65 0.8 0.95 a *1 over voltage limit vovp 4.9 5.1 5.3 v vout terminal output voltage range vorng - - 4.7 v vout terminal under voltage lockout vuvlo 2.3 2.4 2.5 v vout terminal uvlo hysteresis vhys 0.05 0.1 0.15 v switching frequency fsw 3.7 4.0 4.3 mhz @4mhz mode *1 this parameter is tested with dc measurement *2 in mass production, meas ured in the setting that regi ster ?assistcur?=0,? mode?=0
datasheet datasheet 3/17 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 k 15k 001 tsz02201-0g3g0c200280-1-2 21.dec.2012 rev.001 bd6164gut ? pin descriptions no. pin name in/out functions a1 sw in switching terminal a2 gnd - ground b1 ledout out led current source. co nnect to the anode of the flash led. b2 vout out boost output. connect output bypass capacitor very close to this pin. vin is internally connected here. c1 scl in i 2 c clock signal in i 2 c mode c2 sda in/out i 2 c data signal in i 2 c mode ? block diagram ledout dc-dc control ovp sda sw vout gnd vbat 2x1.5uf uvlo i 2 c scl scf 1.0uh 2.2uf
datasheet datasheet 4/17 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 k 15k 001 tsz02201-0g3g0c200280-1-2 21.dec.2012 rev.001 bd6164gut ? cpu i/f the i 2 c i/f provides access to the flas h led driver control registers. i 2 c bus format the writing/reading operation is based on the i 2 c slave standard. ? slave address (60h/61h, including r/w bit) a7 a6 a5 a4 a3 a2 a1 r/w 0 1 1 0 0 0 0 1/0 ? bit transfer data is transferred when scl=h. scl cannot change signal of sda during h at the time of bit transfer. if sda changes while scl has been h, start conditions or stop conditions wi ll occur and it will be interpreted as a control signal. sda scl data line stable; data valid change of data allowed figure 1. i 2 c sda/scl basic waveform ? start and stop condition when sda and scl are both h, dat a is not transferred on the i 2 c- bus. this condition indicates, if sda changes from h to l while scl has been h, it will become start (s) conditions, and an access start, if sda changes from l to h while scl has been h, it will become stop (p) conditions and an access end. sda scl s p start condition stop condition figure 2. i 2 c start/stop condition waveform ? acknowledge it transfers date 8 bits each after the occurrence of start condition. a transmitter opens sda after transfer 8bits date, and a receiver returns the acknowledge signal by setting sda to l. scl 12 89 data output by transmitter data output by receiver acknowledge not acknowledge s start condition clock pulse for acknowledgement figure 3. i 2 c acknowledge waveform
datasheet datasheet 5/17 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 k 15k 001 tsz02201-0g3g0c200280-1-2 21.dec.2012 rev.001 bd6164gut ? writing protocol a register address is transferred by the next 1 byte that tr ansferred the slave address and the write-in command. the 3rd byte writes data in the internal register written in by the 2nd byte, and after 4th byte or, the increment of register address is carried out automatically. however, when a register address turns into the last address(07h), it is set to 00h by the next transmission. after the transmission end, the increment of the address is carried out. s a a a p data register address slave address from master to slave from slave to master a =acknowledge(sd a low) a =not acknowledge(sda high) s=start condition p=stop condition r/w=0(write) data a d7 d6 d5 d4 d3 d2 d1 d0 d7 d6 d5 d4 d3 d2 d1 d0 a 7 a 6 a 5 a 4 a 3 a 2 a 1 a 0 0 x x x x x x x * 1 * 1 register address increment register address increment *1: write timing figure 4. i 2 c write protocol ? reading protocol it reads from the next byte after writing a slave address and r/w bit. the register to read considers as the following address accessed at the end, and the data of the address that carried out the increment is read after it. if an address turns into the last address(07h), the next byte will read out 00h. after the transmission end, the increment of the address is carried out. 1 s a p from master to slave from slave to master r/w=1(read) data a data slave address d7 d6 d5 d4 d3 d2 d1 d0 d7 d6 d5 d4 d3 d2 d1 d0 register address increment x x x x x x x a =acknowledge(sd a low) a =not acknowledge(sda high) s=start condition p=stop condition register address increment a figure 5. i 2 c read protocol ? multiple reading protocols after specifying an internal address, it reads by repeated start condition and changing the data transfer direction. the data of the address that carried out the increment is read after it. if an address turns into the last address, the next byte w ill read out 00h. after the transmission end, the increment of the address is carried out. r/w=0(write) r/w=1(read) slave address register address slave address data data s a a a sr 1 0 a 7 a 6 a 5 a 4 a 3 a 2 a 1 a 0 x x x x x x x x x x x x x x a =acknowledge(sd a low) a =not acknowledge(sda high) s=start condition p=stop condition from master to slave from slave to master register address increment register address increment p a d7 d6 d5 d4 d3d2 d1d0 d7d6 d5d4d3d2d1d0 a sr=repeated start condition figure 6. i 2 c multiple read protocol as for reading protocol and multiple reading protocols, please do a(not acknowledge) after doing the final reading operation. it stops with read when ending by a(acknowledge), and sda stops in the state of low when the reading data of that time is 0. however, this state returns usually when scl is moved, data is read, and a(not acknowledge)is done.
datasheet datasheet 6/17 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 k 15 k 001 tsz02201-0g3g0c200280-1-2 21.dec.2012 rev.001 bd6164gut timing diagram sda scl t su;dat t low s sr p s t buf t sp t hd;sta t su;sta t high t hd;sta t f t r t hd;dat t su;sto t r t f figure 7. i 2 c timing diagram electrical characteristics (unless otherwise specified, ta=25 o c, v th,h1 =1.8v / v th,l1 =0v) parameter symbol spec unit min. typ. max. scl clock frequency f scl 0 - 400 khz rise/fall times sda/scl tf / tf - - 300 ns low period of the scl clock t low 1.3 - - s high period of the scl clock t high 0.6 - - s hold time (repeated) start condition hold time for a repeated start condition t hd;sta 0.6 - - s set-up time for a repeated start condition t su;sta 0.6 - - s data hold time t hd;dat 0.1 - 0.9 s data set-up time t su;dat 100 - - ns set-up time for stop condition t su;sto 0.6 - - s bus free time between a stop and start condition t buf 1.3 - - s
datasheet datasheet 7/17 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 k 15 k 001 tsz02201-0g3g0c200280-1-2 21.dec.2012 rev.001 bd6164gut ? register description register map name addr r/w reset d[7:0] info 00h r 01010011b man [3:0] model[3:0] ver 01h r 00000000b test[3:0] version[3:0] cur 02h r/w 10100000b flashcur[1:0] assistcur r r r r r mod 03h r/w 00000100b r r ledon mode timer[3:0] int 04h r 00000000b ovp scf otp r r r r r r=reserved address ?00h?, design information register 1) model id number info[3:0]: model<3:0> function 0000 to 1111 model id (03h) 2) manufacturer id number info[7:4]: man<3:0> function 0000 to 1111 manufacturer id (05h) address ?01h?, version control register 1) version register ver[3:0] version[3:0] function 0000 to 1111 version register 2) test register ver[7:4] (reserved) test[3:0] function 0000 to 1111 reserved address ?02h?, current setting 1) flash current cur[7:6] flashcur[1:0] flash current default 00 260ma 01 280ma 10 300ma * 11 320ma
datasheet datasheet 8/17 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 k 15 k 001 tsz02201-0g3g0c200280-1-2 21.dec.2012 rev.001 bd6164gut 2) assist light function current cur[5] assistcur assist light current default 0 52ma 1 72ma * address ?03h?, led driver mode setting and timer setting 1) led setting mod[5] ledon led default 0 off * 1 on 2) mode setting mod[4] mode driver state default 0 assist light * 1 flash changing mod[5:4] from 10 to 01, will indicate both a mode change (assistant to flash) and a led deactivation. please note that in this particular case, the mode change will trigger a flash sequence before it will deactivate the led. to activate a fl ash or assistant, we recommend 00 to 11 (for flash) 00 to10 (for assistant), and 10 to 11 (for switching assistant to flash). bd6164gut does not support switching to assistant light mode during a flash sequence. to deactivate flash or assistant, we recommend to writing 00. 3) flash timer setting mod[3:0] (only available in flash mode) timer[3:0] tflash default 0000 30ms 0001 60ms 0010 90ms 0011 120ms 0100 150ms * 0101 180ms 0110 210ms 0111 240ms 1000 270ms 1001 300ms 1010 330ms 1011 360ms 1100 390ms 1101 420ms 1110 450ms 1111 480ms
datasheet datasheet 9/17 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 k 15 k 001 tsz02201-0g3g0c200280-1-2 21.dec.2012 rev.001 bd6164gut address ?04h?, interrupt register 1) over voltage protection int[7] ovp status default 0 ok * 1 fault 2) short circuit fault int[6]: scf status default 0 ok * 1 fault 3) over temperature protection int[5]: otp status default 0 ok * 1 fault
datasheet datasheet 10/17 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 k 15 k 001 tsz02201-0g3g0c200280-1-2 21.dec.2012 rev.001 bd6164gut ? functional description 1. start up sequence after waking up from sleep-mode, the led current is ramped up and down in a controlled way in order to avoid massive inrush current and proper initialization of the current regula tion loop. the maximum current (320ma) should be reached within 0.6-1.0ms. since this process is controlled by the oscillator, the minimum no. of clock cycles (1mhz+7.5%) is 645 (worst-case). 1) flash mode *1: mod<3:0> indicates the programmed flash time *2: mod[5:4] is reset (led off) when timer is expired or by s/w (during led flash, no new flash is accepted) *3: n=programmed flash current / i step (= i led,max /(2 k -1)=10.3ma, k=5 bits) *4: t ramp-up = t initialize + n*t step . (t step = t rmp,max /(2 k -1)=496us/31=16us, k=5 bits). t ramp-down = (n+1)*t step *5: in case that the system goes to transparency mode during ramp down phase, the system does not start boost up. 2) assist light mode *1: in assist light mode, the led is enabled until register assist is reset by s/w or when a flash command is issued *2: t ramp-up = t initialize + n*16us (n=4..6, 1 st step=initialize), t ramp-down = n*16us (n=5..7, to zero) *3: in case that the system goes to transparency mode during ramp down phase, the system does not start boost up. t rampdown *2 led current 10.3ma 0ma mod[7:0]: 0000 0000b 0011 xxxxb* 1 00xx xxxxb* 2 internal led mode off initialize off ramp-up flash ramp-down t rampup *4 n steps *3 t flash t rampdown *4 0v 0v vout vbat ledout vbat led current 10.3ma 0ma mod[7:0] 0000 0000b 0010 0000b* 1 0000 0000b* 1 internal led mode off initialize off assist light t rampup *2 0ma 0v 0v vout vbat v ledout vbat optional t stp (16us) 16us*n t step *n 72ma 52ma 0.25v 0.25v 0.56v 0.56v t ind (~300us) ramp-up ramp-down figure 8. ramp-up/down (flash) figure 9. ramp-up/down (assistant light) flash
datasheet datasheet 11/17 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 k 15 k 001 tsz02201-0g3g0c200280-1-2 21.dec.2012 rev.001 bd6164gut 2. internal power supply bd6164gut has no separate supply for the internal circuitry generally known as ?vdd?. the internal circuitry of the chip is supplied directly from the output voltage (vout). during battery-insertion, the vout node ramps up to battery voltage level (pmos switch is on initially). when the main system is switched on (i.e. by h/w button), the i 2 c terminals are pulled-up, which initializes the led flash driver control core, after which it is goes into sleep mode, listening for i 2 c commands to be activated. as soon as an i 2 c wake-up call from the main system is detected, the internal circuitry is enabled and the led flash driver goes into operational mode (see also item 6 on the next page). any i 2 c ?write command? activates the internal blocks of the bd6164gut, in order to be ready for led activation. however, if the write command is not immediately followed by a flash or assistant light command, please apply a read command to ensure the ic is going back to low-current standby mode. figure 10. internal power supply gnd l sw vout initially low i 2 c i/f and digital control cont r ol sda scl ledout initially low
datasheet datasheet 12/17 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 k 15 k 001 tsz02201-0g3g0c200280-1-2 21.dec.2012 rev.001 bd6164gut 3. over temperature protection (otp) bd6164gut has an over-temperature protection function (thermal shut down). when the die-temperature over 150 degrees, a shutdown-sequence is started: 1) set otp interrupt 2) shutdown dcdc and led driver. 3) wait for the die-temperature to drop below 130 degrees and the interrupt to be cleared by s/w (register read) before allowing new led activity. 4. over voltage protection (ovp) in order to prevent damage to the chip, over voltage prot ection (ovp) detection is implemented. when the output voltage exceeds 5.3v, a shut-down sequence is started: 1) set ovp interrupt 2) stop the switching of the dcdc and go to stand by mode and the register ?ledon? turns to ?0? 3) then ovp register is written as ?1?. this register is to be cleared by being read by s/w. 5. short circuit fault detection (scf) after led driver had started, bd6164gut detects the ledout vo ltage. if the voltage is under (1.2)v, the following actions are taken: 1) set scf interrupt 2) shutdown dcdc and led driver. 3) wait for the scf register to be cleared by s/w (register read) before allowing new led activity. 6. under-voltage lock out in this system, the under-voltage lockout function is performing a self-test by monitoring the voltage on the vout node just before starting up the step-up dcdc converter. this ensur es that any led activity is blocked when the battery voltage is too low. during boost up, the system is not able to accurately detect the battery voltage (no separate vbat pin on the chip), so the uvlo is disabled. in case of an under voltage situation, there is no need to set an interrupt register. 7. the dcdc mode. the dcdc boost converter has three operational modes *1 that provide the supply voltage for the led driver: 1) 4mhz pwm switching mode : when boost-up ratio is high enough to ensure a correct and stable current regulation loop (vbat << vout). in the assistant light mode, system doesn?t go to this mode. 2) 1mhz pwm switching mode: used in case that the boost-up ratio (duty-cycle) becomes too small (vbat vout) for the current regulation to operate properly. 3) transparent mode: used when the battery voltage exceeds the required led driver supply voltage *1 transitions between these operational modes are determined by the headroom voltage (i.e. voltage across led current switch) and the actual pwm duty-cycle information.
datasheet datasheet 13/17 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 k 15 k 001 tsz02201-0g3g0c200280-1-2 21.dec.2012 rev.001 bd6164gut figure 11-a. state control for flash figure 11-b. state control for assistant light 8. discharge function when the led is turned off and the led current has been ramped down, the dcdc converter is turned off. if at that point the voltage on the vout node still exceeds t he battery-voltage, it needs to be discharged to the battery voltage level. this will be achieved by adding a discharge switch in parallel to the pmos switch of the dcdc boost converter. during ramping down, dcdc doesn?t change the state. after ramp down system goes to stand-by mode.) 9. recommended external components coil value vendor parts number size dcr (? ) x y z 1.0uh toko mdt2012-cn1r0 2.0 1.2 1.0 0.15 1.0uh murata lqm21pn1r0ngc 2.0 1.25 0.5 0.19 1.0uh samsung cig21k1r0sce 2.0 1.25 0.9 - capacitor value vendor parts number cin 4.7uf samsung cl05a395mq5nqkl cout 2x1.5f samsung cl14a185mq8sakl 4mhz high boost up dutycycle > 12.5% 1mhz low boost up transparent no pwm switching no boost up dutycyle > 12.5% ram p -down*vhr<0.3 31usec 31usec 1mhz boost up transparent no pwm switching no boost up min duty* ramp-down*ramp-up ram p -down*vhr<0.3 31usec rampdown ram p -down rampdown ram p -down ram p -down
datasheet datasheet 14/17 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 k 15 k 001 tsz02201-0g3g0c200280-1-2 21.dec.2012 rev.001 bd6164gut 10. operational notes ( 1 ) absolute maximum ratings an excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down devices, thus making impossible to identify break ing mode such as a short circuit or an open circuit. if any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety measures including the use of fuses, etc. ( 2 ) operating conditions these conditions represent a range within which characteristic s can be provided approximately as expected. the electrical characteristics are guaranteed under the conditions of each parameter. ( 3 ) reverse connection of power supply connector the reverse connection of power supply connector can break do wn ics. take protective measures against the breakdown due to the reverse connection, such as mounting an external diode between the power supply and the ic?s power supply terminal. ( 4 ) power supply line design pcb pattern to provide low impedance for the wiring bet ween the power supply and the gnd lines. in this regard, for the digital block power supply and the analog block power supply, even though these power supplies has the same level of potential, separate the power supply pattern for the digital block from that for the analog block, thus suppressing the diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns. for the gnd line, give consideration to design the patterns in a similar manner. furthermore, for all power supply terminals to ics, mount a capacitor between the power supply and the gnd terminal. at the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to b e used present no problem including the occurrence of capacity dr opout at a low temperature, thus determining the constant. ( 5 ) gnd voltage make setting of the potential of the gnd terminal so that it will be maintained at the minimum in any operating state. furthermore, check to be sure no terminals are at a potential lower than the gnd voltage including an actual electric transient. ( 6 ) short circuit between terminals and erroneous mounting in order to mount ics on a set pcb, pay thorough attention to the direction and offset of the ics. erroneous mounting can break down the ics. furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the terminal and the power supply or the gnd terminal, the ics can break down. ( 7 ) operation in strong electromagnetic field be noted that using ics in the strong electromagnetic field can malfunction them. ( 8 ) inspection with set pcb on the inspection with the set pcb, if a capacitor is connected to a low-impedance ic terminal, the ic can suffer stress. therefore, be sure to discharge from the set pcb by each proc ess. furthermore, in order to mount or dismount the set pcb to/from the jig for the inspection process, be sure to turn off the power supply and then mount the set pcb to the jig. after the completion of the inspection, be sure to turn off the power supply and then dismount it from the jig. in addition, for protection against static electricity, establish a ground for the assembly process and pay thorough attention to the transportation and the storage of the set pcb. ( 9 ) input terminals in terms of the construction of ic, parasitic elements are inev itably formed in relation to potential. the operation of the parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the input terminal. therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a voltage lower than the gnd respectively, so that any parasiti c element will operate. furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to th e ic. in addition, even if the power supply voltage is applied , apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of electrical characteristics. ( 10 ) ground wiring pattern if small-signal gnd and large-current gnd are provided, it will be recommended to separate the large-current gnd pattern from the small-signal gnd pattern and establish a single ground at the reference point of the set pcb so that resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the small-signal g nd. pay attention not to cause fluctuations in the gnd wiring pattern of external parts as well. ( 11 ) external capacitor in order to use a ceramic capacitor as the external capaci tor, determine the constant with consideration given to a degradation in the nominal capacitance due to dc bias and changes in the capacitance due to temperature, etc.
datasheet datasheet 15/17 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 k 15 k 001 tsz02201-0g3g0c200280-1-2 21.dec.2012 rev.001 bd6164gut vcsp60n1(top view) abl part number marking lot number 1pin mark ( 12 ) thermal shutdown circuit (tsd) when junction temperatures become 150c (typ) or higher, the thermal shutdown circuit operates and turns a switch off. the thermal shutdown circuit, which is aimed at isolat ing the lsi from thermal runaway as much as possible, is not aimed at the protection or guarantee of the lsi. therefor e, do not continuously use the lsi with this circuit operating or use the lsi assuming its operation. ( 13 ) thermal design perform thermal design in which there are adequate margins by taking into account the permissible dissipation (pd) in actual states of use. ( 14 ) selection of coil select the low dcr inductors to decrease power loss for dc/dc converter. ? ordering information b d 6 1 6 4 g u t - e2 part number package gut: vcsp60n1 packaging and forming specification e2: embossed tape and reel ? marking diagram
datasheet datasheet 16/17 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 k 15 k 001 tsz02201-0g3g0c200280-1-2 21.dec.2012 rev.001 bd6164gut ? physical dimension tape and reel information package name vcsp60n1 ( unit : mm )
datasheet datasheet 17/17 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 k 15 k 001 tsz02201-0g3g0c200280-1-2 21.dec.2012 rev.001 bd6164gut ? revision history date revision changes 21.dec.2012 001 new release
datasheet datasheet notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class classb class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification
datasheet datasheet notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.
datasheet part number bd6164gut package vcsp60n1 unit quantity 3000 minimum package quantity 3000 packing type taping constitution materials list inquiry rohs yes bd6164gut - web page distribution inventory

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